| PART |
Description |
Maker |
| AT17LV002 AT17LV002-10BJC AT17LV002-10BJI AT17LV00 |
512K-bit FPGA Configuration EEPROM (5V and 3.3V).
65K-bit FPGA Configuration EEPROM (5V and 3.3V).
256K-bit FPGA Configuration EEPROM (5V and 3.3V).
1M-bit FPGA Configuration EEPROM (5V and 3.3V).
2M-bit FPGA Configuration EEPROM (5V and 3.3V)
FPGA Configuration EEPROM Memory
|
ATMEL[ATMEL Corporation]
|
| AT17LV020-10JC AT17LV020-10JI AT17LV020 AT17C020-1 |
10MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA) 2M X 1 CONFIGURATION MEMORY, PQCC20
2-megabit FPGA Configuration EEPROM Memory
|
Atmel, Corp.
ATMEL[ATMEL Corporation]
|
| AT17F16-30JU AT17F16-30BJC AT17F16-30BJI AT17F16-3 |
FPGA Configuration Flash Memory
|
ATMEL Corporation
聚兴科技股份有限公司
|
| AT17F16-30TQI AT17F16 AT17F16-30BJC AT17F16-30BJI |
16 Mbit In-System Programable PROM (3.3V)
FPGA Configuration Flash Memory
|
ATMEL[ATMEL Corporation]
|
| XCF01SV XCF01SVG XCF01SVO20C XCF01SVO48 XCF01SVOG2 |
Platform Flash In-System Programmable Configuration PROMS 平台Flash在系统可编程配置方案管理系统
Platform Flash In-System Programmable Configuration PROMS 8M X 1 CONFIGURATION MEMORY, PDSO48
|
Xilinx, Inc.
PROM
XILINX INC
|
| AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT- |
25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD)
20NS, OTP, PLCC, COM TEMP(EPLD)
20NS, SOIC, IND TEMP(EPLD)
25NS, SOIC, COM TEMP(EPLD)
20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD)
10MHZ, 8 DIP, COM TEMP(FPGA)
10MHZ, 20 PLCC, IND TEMP(FPGA)
10MHZ, 32 TQFP, COM TEMP(FPGA)
10MHZ, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE)
DIE SALE, 1.8V, 11 MIL(SERIAL EE)
8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE)
65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA)
10MHZ, 20 SOIC, IND TEMP(FPGA)
128K CONFIG MEM, 20 PLCC, COM(FPGA)
EEPROM EEPROM
10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM
512K X 16 FLASH 3V PROM, 120 ns, UUC44
10MHZ, 8 LAP, 5K MOQ(FPGA)
10MHZ, 8 N-SOIC, COM TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA)
512K X 16 FLASH 3V PROM, 80 ns, UUC44
|
ADVANCED MICRO DEVICES INC
|
| X2864HJ-70 X2864BPI-18 X2864HJ-90 X2864BGM-12 X286 |
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, SOT23, IND TEMP, GREEN, 1.8V(SERIAL EE)
32M CONFIG FLASH, 44 PLCC, IND(FPGA)
10 MHZ, 8 LAP, IND TEMP(FPGA)
25NS, 24 SOIC, IND TEMP(EPLD)
10MS, 8 TSSOP, EXT TEMP, 2.7V(SERIAL EE)
DIE SALE,1.8V, 11MIL(SERIAL EE)
10MHZ, 8 PDIP, IND TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA)
10MHZ, 44 TQFP, COM TEMP(FPGA)
128Kx8 EEPROM
20NS,CERDIP,883C; LEV B FULLY COMPLIANT(EPLD)
10MHZ, 20 SOIC, COM TEMP, 5K MOQ(FPGA)
10 MHZ, 20 PLCC, IND TEMP, GREEN(FPGA) x8的EEPROM
30MHZ, 3.3V, 8 LAP, COM TEMP(FPGA) x8的EEPROM
10MHZ, 20 PLCC, IND TEMP(FPGA) x8的EEPROM
30MHZ, 20 PLCC, IND TEMP, GREEN(FPGA) x8的EEPROM
|
ITT, Corp.
Pericom Technology (Shanghai) CO., Ltd.
Diodes, Inc.
Electronic Theatre Controls, Inc.
|
| AT17LV010-10DP |
AT17LV010-10DP Advance Information [Updated 7/03. 11 Pages]
FPGA Configuration EEPROM packaged in the 28-pin 400 mils wide FP package.
|
Atmel
|
| XC7K325T-1FBG676C XC7K325T-3FFG676C XC7K160T-1FBG4 |
FPGA, PBGA676 LEAD FREE, FBGA-676
FPGA, PBGA484
FPGA, PBGA900
|
XILINX INC
|
| XQ1701L-SERIES XQR1701L-SERIES XQ1701LCC44M XQR170 |
Cascadable for storing longer or multiple bitstreams
QPro configuration PROM. Radiation-hardened.
QPro configuration PROM. SMD number 5962-9951401NXB.
QPro configuration PROM. SMD number 5962-9951401QYA
QPro Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR) 1M X 1 CONFIGURATION MEMORY, PDSO20
1M X 1 CONFIGURATION MEMORY, CQCC44
|
Xilinx, Inc.
XILINX INC
|
| DS123 XCF04SVOG20C XCF08PVOG48C XCF01SVOG20C XCF02 |
Platform Flash In-System Programmable Configuration PROMs
Low-Power Advanced CMOS NOR Flash Process
|
Xilinx, Inc
|
| TSC390 TSC395 TSC391 TSC392 TSC393 TSC394 TSC391AL |
FPGA, CYCLONE III, 80K LE, 780FBGA Programmable Logic Type:FPGA; Logic IC function:FPGA; Logic IC family:Cyclone III; Logic IC Base Number:3; I/O lines, No. of:429;
IC FLEX 6000 FPGA 10K 100-TQFP
IC CYCLONE III FPGA 80K 484 UBGA
Dual Interface Buffers
|
MICROSEMI[Microsemi Corporation]
|
|
